发明名称 REFRIGERATING CHUCK TABLE
摘要 <p>PURPOSE: To freeze and fix a wafer in a sucked state by supplying water and without being frozen by a method wherein a suction part which socks and holds the wafer and a refrigeration part which refrigerates and fixes the wafer held by the suction part are installed at a chuck table. CONSTITUTION: A chuck table T4 is constituted of a lower-part table 31 and of an upper-part table 41 which is formed at the lower-part table 31 so as to be detachable. A suction part 32 which is composed of a plurality of holes is formed on the bottom face of a fitting part 31a by which the lower-part table 31 attaches and removes the upper-part table 41. In addition, a suction part 42 which is composed of many small holes in a surface plate 41a is formed in the upper-part table 41, and refrigeration parts 43 which are composed of thermionic elements such as Peltier elements or the like are arranged and installed on the rear of a surface plate 41a so as not to close the suction part 42. In addition, a coupling hole 41b which is made to communicate with a through hole 31b in the center of the lower-part table 31 is formed in the central part of a bottom plate.</p>
申请公布号 JPH08222530(A) 申请公布日期 1996.08.30
申请号 JP19950044847 申请日期 1995.02.09
申请人 DISCO ABRASIVE SYST LTD 发明人 MORI TAKASHI
分类号 B23Q3/08;H01L21/301;H01L21/304;H01L21/68;H01L21/683;(IPC1-7):H01L21/301 主分类号 B23Q3/08
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