| 摘要 |
PURPOSE: To provide a plastic molded semiconductor light emitting device capable of enduring clinch stress generated on a lead. CONSTITUTION: In a plastic molded semiconductor light emitting device 20, an element mounting part 23 of a first lead 21 is equipped with a mounting flange part 27 which protrudes in the thickness direction on both side surfaces of the first lead 21, and a recessed surface part 28 formed on the upper surface of the mounting flange part 27, and a semiconductor light emitting element 24 is fixed on the recessed surface part 28 at almost the central part in the thickness direction. The top of a second lead 22 is equipped with a corresponding flange part 30 which protrudes in the thickness direction on both side surfaces of the second lead 22. Since the mounting flange part 27 formed on the first lead 21 and the corresponding flange part 30 formed on the second lead 22 are brought into rigid and close contact with a plastic molded object 26, when clinch stress is applied, stress generated on the lead is dispersed so that cushioning action is generated. |
