发明名称 MANUFACTURE OF CHIP-TYPE CERAMIC ELECTRONIC COMPONENT
摘要 <p>PURPOSE: To realize uniform and stable glass coating at a low cost by mixing and thermally treating glass granulated powder and a chip-type ceramic electronic component for performing glass coating for a surface of a chip-type ceramic electronic component. CONSTITUTION: Polyvinyl alcohol is added to borosilicate zinc glass powder as binder by 2 to 10wt.%. After pure water is added thereto and mixed, it is dehydrated, dried and granulated. Barreling is performed for a sintered body of a chip-type varistor 6 and glass granulated powder 5 is added in a range of 0.1 to 2wt.% to a weight of a sintered body. After well mixed, it is put in an alumina magnetic pot 1 of a heat resistant container. Heat treatment is carried out at about 600 to 800 deg.C while the alumina magnetic pot 1 is rotated.</p>
申请公布号 JPH08222411(A) 申请公布日期 1996.08.30
申请号 JP19950022984 申请日期 1995.02.10
申请人 MURATA MFG CO LTD 发明人 NAKAMURA KAZUYOSHI;TAKAGI HIROSHI;KANEKO KAZUHIRO
分类号 H01G4/12;H01C7/10;(IPC1-7):H01C7/10 主分类号 H01G4/12
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