| 摘要 |
PURPOSE: To see that the shape of a bump electrode is hard to loose its appearance by constituting the bump electrode out of the bump electrode body consisting of high fusing point metal, and the bump electrode surface layer consisting of low-fusing point solder made at a specified section, at least, of the surface of the bump electrode body. CONSTITUTION: To begin with, an insulating film 22 and a connection pad 23 are made on a silicon substrate 21, and the section excluding the center of the topside is covered with a protective film 24 so as to prepare a thing where the center of the connection pad 23 is exposed. Next, a layer 26 for formation of a base metallic layer is made all over the topside. Next, a plated resist layer 27 is made relatively thick at the section excluding the part corresponding to the connection pad 23. Next, electrolytic plating is performed, whereby a bump electrode body 29 consisting of high fusing point solder whose fusing point is 300 deg.C or over is made in specified thickness on the topside of the layer 26 for formation of the base metallic layer within the aperture 28 of the plated resist layer 27, and next, a bump electrode 30 consisting of low-fusing point solder whose fusing point is 200 deg.C or less is made on the topside. Next, the plated resist layer 27 is exfoliated. |
