| 摘要 |
PURPOSE: To improve the electromagnetic shielding function of an electromagnetic shielding film for a package so as to efficiently reduce radiation noise and cross-talk noise, etc., by protruding upward the upper surface of a metal block provided on a substrate from an IC chip and covering the metal block with an insulator so that its upper surface can be exposed on the upper surface of the insulator, and then, coating the upper surfaces of the insulator and metal block with a plated-metal layer. CONSTITUTION: An IC chip 25 connected to a signal line 18 and a metal block 27 connected to a ground line 19 are mounted on a substrate 15 having the lines 18 and 19 and the upper surface of the block 27 is protruded upward from the upper surface of the chip 25. Then the lines 18 and 19, chip 25, and block 27 are covered with an insulator 23 so that the upper surface of the block 27 can be exposed on the upper surface of the insulator 23 and the upper surfaces of the insulator 23 and block 27 are coated with a plated metal layer 31. Therefore, the electromagnetic shielding function of a package thus formed is improved and the malfunction of the package caused by radiation noise, cross-talk noise, etc., can be reduced. |
