| 摘要 |
<p>PURPOSE: To reduce the size of a sensor element so as to provide a flow sensor which is small-sized and excellent in characteristics and reliability by stacking the substrates where a heating resistor and a temperature compensating resistor are formed to be united in a body. CONSTITUTION: A sensor element 10 is formed by interposing a third substrate between a first substrate 11 where a heating resistor RH is formed and a second substrate 12 where a temperature compensating resistor RK is formed, and stacking the respective substrates 11, 12, 13 to be united in a body. A cavity part 14 is formed in the central part of the third substrate 13.</p> |
