| 摘要 |
<p>PURPOSE: To obtain a stripping apparatus by which an outer semiconductive layer can be stripped simply and uniformly. CONSTITUTION: A able fitting part 11 is fitted to, and arranged at, a part in which an outer semiconductive layer 4 at the edge of a power cable is exposed. Then, the cable fitting part 11 is slid on the circumferential face of the outer semiconductive layer 4, and the outer layer 4 is cut by a cutting edge 15. At this time, a roller 16 turns the outer layer 4, and the intervale between an arm 13 supporting the cutting edge 14 and the outer layer 4 is maintained to be constant.</p> |
