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发明名称
METHOD AND APPARATUS FOR OPENING PACKAGE OF RESIN-SEALED SEMICONDUCTOR DEVICE
摘要
申请公布号
JPH08222592(A)
申请公布日期
1996.08.30
申请号
JP19950025048
申请日期
1995.02.14
申请人
NEC CORP
发明人
SAKAKIBARA HIROSHI
分类号
H01L21/66;H01L21/56;(IPC1-7):H01L21/56
主分类号
H01L21/66
代理机构
代理人
主权项
地址
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