发明名称 ELECTRONIC PARTS MOUNTING DEVICE
摘要 PURPOSE: To reduce the size and weight of a mounting head by raising a selected suction nozzle while the nozzle holds electronic parts by suction and lowering the nozzle together with a mounting head main body to mount the electronic parts on a substrate. CONSTITUTION: The mounting head 10 of an electronic parts mounting device is provided with a mounting head main body 20 which can freely move in the vertical direction against an index table 5 and is positioned at a plurality of positions in the direction of rotation of the table 5 and one kind of nozzle selected by means of a selecting means out of a plurality of kinds of suction nozzles 11 held at the lower end section of the main body 20 is protruded down from the other nonselected nozzles. The nozzle 11 attracts electronic parts 100 by suction when the main body 20 is lowered and mounts the parts 100 on a substrate when the main body 20 is lowered after the table 5 makes intermittent rotation. Therefore, the size and weight of the mounting head can be reduced, because the head can attract and hold parts having various kinds of shapes and sizes by suction by changing the kind of the suction nozzle selected by means of the selecting means.
申请公布号 JPH08222895(A) 申请公布日期 1996.08.30
申请号 JP19950046349 申请日期 1995.02.10
申请人 TDK CORP 发明人 TANDO SHUICHI;HOSHIKAWA HIDEKI
分类号 B23P21/00;H05K13/04 主分类号 B23P21/00
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