LEAD FRAME AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: To provide a lead frame adaptable to multi-terminal design of semiconductor devices and after-process such as assembling and mounting steps by making one face of the top end of each inner lead parallel to the faces of other parts thereof and the other three faces thereof recessed. CONSTITUTION: A lead frame 10 for resin-sealed semiconductor devices mounts a semiconductor element on inner lead tip parts 11A through bumps and electrically connects it to external circuits by outer leads 12 integrated with inner leads 11. The tip part 11A is thinner than other parts of the frame 10 and nearly rectangular in cross-section. One face of the part 11A is parallel to other parts faces of the frame 10 and other three faces of the lead 11 are made recessed.