| 摘要 |
PURPOSE: To provide a semiconductor device having plural input buffer circuits which receive a common control signal and to make differences among control signal delays, which are input to the input buffer circuits, as small as possible. CONSTITUTION: When a control signal is input to a lead terminal 6, it is transmitted to metal thin wires 7a-7d and to bonding pads 2a-2d respectively. Control signals output from the bonding pads 2a-2d are transmitted at high speed after the input from the lead terminal 6 and are input to input nodes of input buffer circuits 3a-3d via wiring layers 4a-4d without any difference of signal transmission delay times. The input buffer circuits 3a-3d can be arranged near predetermined circuits controlled by the control signals and rear the bonding pads 2a-2d, and therefore the wiring layers 4a-4d for connecting the input nodes of the input buffer circuit 3a-3d with the bonding pads 2a-2d can be shortened to such an extent that the differences of signal transmission delay times are negligible. |
