发明名称 PASTE APPLYING METHOD OF DIE BONDER AND ITS DEVICE
摘要 PURPOSE: To uniformly apply paste without pattern inequality by a method wherein a generation pulse rate and a pulse number of a pulse generator for a driver of an XY table for a nozzle are changed and a transfer speed of the nozzle is equalized in straight line applying between separate optical two points. CONSTITUTION: There are provided pulse generators 6x, 6y for generating a specific pulse by an instruction of a CPU 5, and drivers 8x, 8y for drive- controlling an XY table 7 for transferring a nozzle 3 in the XY directions by this generation pulse. When drive-controlling the XY table 7, a transfer speed of the drivers 8x, 8y is decided by an objective constant speed value and an applying distance between separate optical two points. Based on this decision, a generation pulse rate and its pulse number are respectively given to the pulse generators 6x, 6y by the instruction of the CPU 5, and the transfer speed of the nozzle 3 is equalized in straight line applying between the separate optical two points. Thus, paste is uniformly applied without pattern inequality.
申请公布号 JPH08222588(A) 申请公布日期 1996.08.30
申请号 JP19950028027 申请日期 1995.02.16
申请人 NICHIDEN MACH LTD 发明人 HONDA MOTOHARU
分类号 H01L21/52;(IPC1-7):H01L21/52 主分类号 H01L21/52
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