| 摘要 |
PURPOSE:To improve interlayer adherence and halo resistance by bringing a copper oxide layer formed by oxidizing a copper circuit of an inner layer circuit into contact with metal having lower oxidizing/reducing potential than CuO in electrolyte, and then integrally forming a laminate in which outer layer materials are disposed via prepregs. CONSTITUTION:The surface of a copper circuit 1 of an inner layer material 2 having the copper circuit 1 one or both side faces is oxidized, and a copper oxide layer 3 of CuO, Cu2O is formed. Then, the layer 3 is brought into contact with metal having lower oxidizing/reducing potential than that of CuO in electrolyte to roughen the surface of the circuit 1. A predetermined number of prepregs 3 and outer layer materials 5 are arranged on the obtained surface, and laminated integrally. Thus, the interlayer adhesive strength of the material 2 and the prepreg 4 layer is improved to realize excellent halo resistance. |
