发明名称 METHOD FOR INJECTION MOLDING A THIN HOUSING FOR A PORTABLE TELEPHONE
摘要 In order to mold with good yield a thin housing for a portable telephone having good properties such as a very high bending strength and a good molded surface without any surface sink, as shown in Fig. 3, after resin is injected from a pin gate (4) in a front mold (1) into a cavity (31), projecting members (28) are caused to project into the cavity (31) while the resin remains in a molten state, and push button insertion holes including the pin gate portion (4) are made by punching in such a manner that the ends of the projecting members and resin are pushed together into fit-in holes (12). Simultaneously, after a pin for forming a tapping hole in a boss forming hole (29) is slightly pushed into the cavity (31), the resin is cooled and set, and thereafter both front and back molds are separated, thereby molding a thin housing for a portable telephone.
申请公布号 WO9626063(A1) 申请公布日期 1996.08.29
申请号 WO1996JP00290 申请日期 1996.02.09
申请人 POLYPLASTICS CO., LTD.;OKADA, TSUNEYOSHI;MIYAZAKI, HIROTAKA 发明人 OKADA, TSUNEYOSHI;MIYAZAKI, HIROTAKA
分类号 B29C45/26;B29C45/00;B29C45/38;B29C45/56;B29L31/34;H04M1/02;(IPC1-7):B29C45/56 主分类号 B29C45/26
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