发明名称 |
METHOD FOR INJECTION MOLDING A THIN HOUSING FOR A PORTABLE TELEPHONE |
摘要 |
In order to mold with good yield a thin housing for a portable telephone having good properties such as a very high bending strength and a good molded surface without any surface sink, as shown in Fig. 3, after resin is injected from a pin gate (4) in a front mold (1) into a cavity (31), projecting members (28) are caused to project into the cavity (31) while the resin remains in a molten state, and push button insertion holes including the pin gate portion (4) are made by punching in such a manner that the ends of the projecting members and resin are pushed together into fit-in holes (12). Simultaneously, after a pin for forming a tapping hole in a boss forming hole (29) is slightly pushed into the cavity (31), the resin is cooled and set, and thereafter both front and back molds are separated, thereby molding a thin housing for a portable telephone.
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申请公布号 |
WO9626063(A1) |
申请公布日期 |
1996.08.29 |
申请号 |
WO1996JP00290 |
申请日期 |
1996.02.09 |
申请人 |
POLYPLASTICS CO., LTD.;OKADA, TSUNEYOSHI;MIYAZAKI, HIROTAKA |
发明人 |
OKADA, TSUNEYOSHI;MIYAZAKI, HIROTAKA |
分类号 |
B29C45/26;B29C45/00;B29C45/38;B29C45/56;B29L31/34;H04M1/02;(IPC1-7):B29C45/56 |
主分类号 |
B29C45/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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