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发明名称
METHOD AND DEVICE FOR INSPECTION OF BONDING STATE BETWEEN LSI TERMINAL AND SUBSTRATE
摘要
申请公布号
JPH0374857(A)
申请公布日期
1991.03.29
申请号
JP19890211589
申请日期
1989.08.17
申请人
ONO SOKKI CO LTD
发明人
SUZUKI HIDEO;TAKESUTE TAKAAKI
分类号
G01L5/00;H01L21/66
主分类号
G01L5/00
代理机构
代理人
主权项
地址
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