| 摘要 |
PURPOSE:To decrease the mandays of the checking and correction of a solder bump remarkably by a method wherein a solder ball is held into a through-hole in a solder- ball holding plate by a suction means from one side of the through-hole, the holding plate and a circuit substrate are superposed and heated, the solder ball in the through- hole is melted and the solder bump is formed to the specified section of the circuit substrate. CONSTITUTION:When a solder ball holder 12 is fitted into a recess 19 in a carrier 11 and the inside of a recess 14 is evacuated (vacuum) under the state in which the underside of the holder 12 is brought into contact with solder balls in a solder ball vessel, the solder balls 4 are engaged and held into each through-hole 16 in a holding plate 15. On the other hand, specified sections 2 to which solder bumps must be formed are shaped into the recess 21 of a base 13, and a circuit substrate 1 coated with solder flux 3 is fitted. When recesses 22 are engaged with projections 20 and a carrier 11 is superposed onto the base 13, the evacuation of the recess 14 is released, the carrier 11 is removed, leaving the solder ball holder 12 and the base 13 on which the solder ball holder 12 is loaded is heated at a solder fusion temperature, each solder ball 4 is melted, and the solder bumps are formed onto the specified sections 2. |
