| 发明名称 |
SEMICONDUCTOR DEVICE OF GLASS CERAMIC PACKAGE TYPE |
| 摘要 |
<p>PURPOSE:To reinforce the lead intensity at the small aperture part where the concentrated stress is produced, by increasing the shorter diameter of te small aperture of the lead frame through which the lead passes about 5 times as large as the thickness of the lead and filling the solder into the small aperture.</p> |
| 申请公布号 |
JPS5390868(A) |
申请公布日期 |
1978.08.10 |
| 申请号 |
JP19770004909 |
申请日期 |
1977.01.21 |
| 申请人 |
HITACHI LTD |
发明人 |
OOTSUKA KANJI;YAMAMOTO EIJI;USAMI TAMOTSU |
| 分类号 |
H01L23/04;H01L23/08;H01L23/12;H01L23/48;H01L23/50 |
主分类号 |
H01L23/04 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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