摘要 |
<p>1364832 Semi-conductor devices SIEMENS AG 1 March 1973 [2 March 1972] 10092/73 Heading H1K A semi-conductor device is held in a coolant duct by pressure exerted on it by the insulating inner wall of the duct. As shown in Fig. 1, a pair of devices 2, 3 in housings 1 are clamped between ribbed electrode blocks 8, 9, 10 within an elliptical tube 11 of resilient glass reinforced plastics or insulation coated spring steel, the component parts being slid into the tube while it is vertically expanded by application of pressure at 11a. As shown the coolant channel is restricted by inserts 20 and may be divided by longitudinal partition 16. A plurality of such arrangements may be disposed side by side in axial alignment with insulating rings between adjacent ducts and with inlet and outlet manifolds at opposite ends, or, if one end is blanked off and longitudinal partitions provided, at the same end of the assembly. Electrode blocks of adjacent arrangements are interconnected by copper braids threaded through them.</p> |