发明名称 |
Epoxy resin compound for use in laminated sheet |
摘要 |
<p>An epoxy resin composition featured in containing, in a matrix of an epoxy resin having more than two epoxy groups in each molecule, a phenolic hardening agent having more than two phenolic hydroxyl groups in each molecule, a special hardening promotion agent, a solvent for the hardening promotion agent, and a guanamine compound, and capable of obtaining a prepreg excellent in the preservation stability and, less causing a solvency erosion (halo phenomenon) due to an infiltration of plating solution along boundaries between a printed copper circuit formed in an inner-layered circuit board and a resin forming the prepreg, is realized.</p> |
申请公布号 |
EP0728789(A2) |
申请公布日期 |
1996.08.28 |
申请号 |
EP19960200451 |
申请日期 |
1996.02.22 |
申请人 |
MATSUSHITA ELECTRIC WORKS, LTD. |
发明人 |
NAKAMURA, YOSHIHIKO;MATSUMURA, MASAHIRO;IWAMOTO, NARIMASA;MOTOBE, HIDETSUGU;HATTA, YUKIO |
分类号 |
C08G59/50;C08G59/62;C08G59/68;H05K1/03;(IPC1-7):C08G59/68 |
主分类号 |
C08G59/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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