| 摘要 |
A semiconductor chip (15) is mounted on a heat-radiating fin (11). A ceramic plate (14) is mounted on the fin (11), surrounding the semiconductor chip (15). A copper pattern is provided on the ceramic plate. A real frame (12) is connected to the copper pattern, located above the heat-radiating fin (11) and spaced apart therefrom by a predetermined distance. The copper pattern and the semiconductor chip (15) are connected by means of wires (17). The wires (17), the chip (15), the ceramic plate (14) and a part of the lead frame (12) are encapsulated in a mass of resin. <IMAGE> |
