摘要 |
In a semiconductor package stack module, an LSI (Large Scale Integrated circuit) is mounted, via fine bumps, on a ceramic carrier substrate or a flexible carrier film on which wiring conductors are formed. After a seal resin has been injected, the chip is thinned by, e.g., grinding. A plurality of such carrier substrates or carrier films are connected to each other by bumps via through holes which are electrically connected to the wiring conductors, thereby completing a tridimensional stack module. The module achieves a miniature, thin, dense, low cost, and reliable structure without resorting to a wire bonding system or a TAB (Tape Automated Bonding) system. In addition, the module has a minimum of wiring length and a desirable electric characteristic. <IMAGE> <IMAGE> <IMAGE> <IMAGE> <IMAGE> |
申请人 |
NEC CORPORATION |
发明人 |
SENBA, NAOJI;SHIMADA, YUZO;UTSUMI, KAZUAKI;TOKUNO, KENICHI;MORIZAKI, IKUSHI;DOHYA, AKIHIRO;BONKOHARA, MANABU |