| 摘要 |
<p>PURPOSE: To efficiently work diamond with high precision by rubbing the surface of a diamond wafer with a grinding disk contg. diamond abrasive grain to generate heat, simultaneously spraying a substance causing a thermochemical reaction with the diamond and lowering the hardness by the reaction. CONSTITUTION: A diamond wafer is fixed at the center of a discoid holder and pressed on a rotating grinding disk, the relative speed of the contact point between the disk and the wafer surface is controlled to a high speed of 5-15m/s, the substrate surface is kept at 200-800 deg.C, a substance (e.g. iron) entering into solid soln. with a hard substance (diamond) is sprayed on the disk to bring about a chemical reaction, hence the hardness of the diamond is lowered, and the diamond is ground. The rough oblique drawing of the grinder is shown in the figure. A pressure at 0-30000N/m<2> is exerted on the rotating shaft 4 of a load cell 5. The diamond wafer is pressed on a grinding disk 1 by the normal load. The powder (liq.) of a reacting substance diffusing into the hard substance and subjected to a chemical reaction is sprayed from a spraying device 6.</p> |
