发明名称 POLISHING DEVICE
摘要 PURPOSE: To enable a polishing process to be effected stably by providing a means for holding an object to be polished in such a way that the object faces a polishing pad, while permitting the circulation of the fluid of fluid supply and discharge means. CONSTITUTION: A polishing device top ring 11 comprises a drive mechanism for raising and lowering the top ring 11, a rotating shaft portion 11 a connected to an air cylinder mechanism applying load to the top ring 11, and a holding portion 11b for holding an object to be polished. Voids 12 are provided inside the holding portion 11b and are communicated with a refrigerant supply pipe 13 through which cooling water or gas is supplied and with a refrigerant discharge pipe 14 through which fluid flowing through the top ring 11 is discharged. Further, a storage portion 15 for accommodating the object to be polished is provided, and communicating holes 16 which communicate with the voids 12 are formed in the bottom surface of the storage portion 15. The refrigerant is circulated via the top ring 21 (11), a vacuum source 22, a temperature regulator 23, a pump 24, and a pressure regulator 25 so as to control the temperature of the object to be polished, thus stabilizing polishing speed.
申请公布号 JPH08216023(A) 申请公布日期 1996.08.27
申请号 JP19950031094 申请日期 1995.02.20
申请人 TOSHIBA CORP 发明人 NAKADA RENPEI;KANEKO HISAFUMI;SASAKI YASUTAKA;HAYASAKA NOBUO
分类号 B24B49/14;B24B37/015;B24B49/16;B24B57/02;H01L21/304 主分类号 B24B49/14
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