发明名称 DIE FOR MOLDING OPTICAL DISC SUBSTRATE AND SYSTEM THEREOF AS WELL AS MOLDING METHOD
摘要 PURPOSE: To shorten a molding cycle by cutting a cooling time with a concurrent action to maintain high transfer property. CONSTITUTION: A temperature adjustment groove 3 for heating and a temperature adjustment groove 4 for cooling are provided in a mirror plane block which is installed on a fixed de 1 and a movable die 2 respectively. Further, the groove 3 and the groove 4 are alternately arranged across an area from an inner periphery to an outer periphery. At the same time, in order to chance the transfer property of the outer peripheral part, so many temperature adjustment groove 3 for heating are densely arranged. Thus the temperature adjustment grooves which are independently working for both cooling and heating purposes, are provided in the mirror plane block 5. In addition, temperature adjustment media whose discharge pressure is controlled by synchronizing the temperature adjustment grooves to the molding cycle of a molding machine, are caused to circulate for molding. Consequently, a die capable of molding a substrate with high transfer property and excellent face uniformity can be obtained.
申请公布号 JPH08216217(A) 申请公布日期 1996.08.27
申请号 JP19950042707 申请日期 1995.03.02
申请人 RICOH CO LTD 发明人 UEDA KEIJI;JODAI YASUHIRO
分类号 B29C45/26;B29C45/73;B29L11/00;G11B7/26;(IPC1-7):B29C45/73 主分类号 B29C45/26
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