发明名称 Process of curing hydrogen silsesquioxane coating to form silicon oxide layer
摘要 A process is disclosed for curing a hydrogen silsesquioxane coating material to form SiO2 by first placing the coating material in a preheated furnace; igniting a plasma ignited in the furnace immediately after insertion of the coating material therein; then raising the temperature of the furnace up to a predetermined curing temperature, while still maintaining the plasma in the chamber; maintaining the coating material at the curing temperature until substantially all of the coating material has cured to form SiO2; and then extinguishing the plasma and cooling the furnace. In another embodiment, the coating material is cured, with or without the assistance of heat and a plasma, in an ultrahigh vacuum, i.e., a vacuum of at least 10-5 Torr or better, and preferably at least 10-6 Torr or better.
申请公布号 US5549934(A) 申请公布日期 1996.08.27
申请号 US19950462651 申请日期 1995.06.05
申请人 LSI LOGIC CORPORATION 发明人 GARZA, MARIO;CHAO, KEITH
分类号 C08G77/12;C09D183/04;C23C18/12;H01L21/316;(IPC1-7):C08J7/18 主分类号 C08G77/12
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