发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent the pellet size and the diffusion process man-hour from being increased and circuit characteristics from being deteriorated due to the use of different pads for every package. CONSTITUTION:Pellets 7, 8, 9, 10, 11, and 12 for assembly are aligned in a row in a longitudinal direction on a pellet P and the matching with external leads 1, 2, 3, 4, 5, and 6 is achieved, thus achieving assembly in either package of SOJ (Fig.1 (a)) and ZIP (Fig.1 (b)) with the same arrangement of pads.
申请公布号 JPH04294554(A) 申请公布日期 1992.10.19
申请号 JP19910083377 申请日期 1991.03.22
申请人 NEC CORP 发明人 KAWADA KOJI
分类号 H01L21/60 主分类号 H01L21/60
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