Packaging and cooling structure for the personal processor module

摘要

A housing and cooling structure for a personal processor module (PPM) is provided which includes a case which is sealed and will fit within both a desktop sized docking station and a smaller notebook sized docking station. Within the case, the components which make up the PPM are located in such a way as to minimize the size of the printed circuit boards. In addition, a cooling mechanism is provided which cools all of the components within the case. Also, the PPM has structure for converting 3.3 volt signals into 5 volt signals and for permitting easy upgrades.