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发明名称
MOLD FOR RESIN SEAL MOLDING OF ELECTRONIC PART
摘要
申请公布号
JPH08216180(A)
申请公布日期
1996.08.27
申请号
JP19950050497
申请日期
1995.02.14
申请人
TOWA KK
发明人
OSADA MICHIO
分类号
B29C45/02;B29C45/14;B29C45/26;H01L21/56;(IPC1-7):B29C45/02
主分类号
B29C45/02
代理机构
代理人
主权项
地址
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