| 摘要 |
A method for making a carrier strip (1) for modules comprising an electronic card microcircuit. The method comprises the steps of making sets of holes (3) in an insulating film (2), providing sets of conductive pads (5) in a conductive film (4), and adhering together the insulating film (2) and the conductive film (4) with the sets of holes (3) and the sets of conductive pads (5) in a mutually facing relationship. The method is characterised in that the step of making the sets of holes (3) is performed after the insulating film (2) and the conductive film (4) are adhered to one another using a laser beam (11). An apparatus for carrying out the method is also disclosed.
|
