EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR ELEMENT

摘要

The resin compositions are prepared by adding epoxide-siloxane modified polyamic acid to the conventional epoxy resin compositions comprising crezol novolac-type epoxy resin, hardener, inorganic filler, and curing accelerator. By the addition, the resin compositions have highly enhanced heat resistance and thus can result in a remarkable decrease of the number of cracks generated during the vapor soldering process.