| 摘要 |
<p>A contact structure of a handler of self-weight-dropping type that is easy to deal with thinned IC device and IC socket to be measured. To this end, a gap (9) corresponding to the dimensions of a carrier (3) housing therein an IC device (4) is formed by a roof connecting portion (7) and a rail (5), and the carrier (3) is supported by the gap (9) so that the IC device (4) is caused to drop and slide down to a contact position. In addition, an opening (8) is provided in the roof connecting portion (7) at the contact position, and upper and lower sides of the opening (8) at the roof connecting portion (7) are made roof A (1) and roof B (2), respectively, whereby the carrier (3) is supported by the roof A (1) and roof B (2) so that contact of the IC socket with the IC device is effected at the contact position.</p> |
