VERFAHREN UND VORRICHTUNG ZUM SPALTEN VON HALBLEITERPLATTEN

摘要

PCT No. PCT/EP92/01867 Sec. 371 Date May 17, 1994 Sec. 102(e) Date May 17, 1994 PCT Filed Aug. 14, 1992 PCT Pub. No. WO93/04497 PCT Pub. Date Mar. 4, 1993A method and apparatus are described for cleaving a relatively thin semiconductor wafer for inspecting a target feature on a workface thereof by: producing, on a first lateral face of the semiconductor wafer, laterally of the workface on one side of the target feature, an indentation in alignment with the target feature; and inducing by impact, in a second lateral face of the semiconductor wafer, laterally of the workface on the opposite side of the target feature, a shock wave substantially in alignment with the target feature and the indentation on the first lateral face, to split the semiconductor wafer along a cleavage plane essentially coinciding with the target feature and the indentation.