发明名称 |
MONITORING METHOD OF SOLDERING A PCB |
摘要 |
The method is for displaying the 3D shape for a soldering state of the 2D information to inspect it, comprises the steps of; illuminating the soldering on a PCB to make a diffused reflection to get a shape information and a light information; sending the information to the image processing unit through the CCD camera; converting the information to the numeral; sending the numeral to the computer to display 3D shape on a monitor to inspect the soldering on PCB. The method enhances the reliability and the productivity and automates the inspection process.
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申请公布号 |
KR960011484(B1) |
申请公布日期 |
1996.08.22 |
申请号 |
KR19930005398 |
申请日期 |
1993.03.31 |
申请人 |
DAEWOO ELECTRONICS CO., LTD. |
发明人 |
LIM, CHANG - SOO |
分类号 |
H05K3/34;(IPC1-7):H05K3/34 |
主分类号 |
H05K3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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