发明名称 MONITORING METHOD OF SOLDERING A PCB
摘要 The method is for displaying the 3D shape for a soldering state of the 2D information to inspect it, comprises the steps of; illuminating the soldering on a PCB to make a diffused reflection to get a shape information and a light information; sending the information to the image processing unit through the CCD camera; converting the information to the numeral; sending the numeral to the computer to display 3D shape on a monitor to inspect the soldering on PCB. The method enhances the reliability and the productivity and automates the inspection process.
申请公布号 KR960011484(B1) 申请公布日期 1996.08.22
申请号 KR19930005398 申请日期 1993.03.31
申请人 DAEWOO ELECTRONICS CO., LTD. 发明人 LIM, CHANG - SOO
分类号 H05K3/34;(IPC1-7):H05K3/34 主分类号 H05K3/34
代理机构 代理人
主权项
地址