| 摘要 |
The method has the feature that a laser diode(3) is fabricated by depositing a metal electrode(5) using a thermal evaporator at a 10 micrometer Torr and evaporating a solder(4) in the thickness of 1.5 micrometer and the fabricated laser diode is joined by being arranged on the submount(2). The method reduces manufacturing time by removing the process of aligning the solder on the submount.
|
