APPARATUS AND METHOD FOR A RELIABLE RETURN CURRENT PATH FOR SPUTTERING PROCESSES

摘要

A method for establishing and maintaining a reliable ground for reactive sputtering systems. A spatially extended high density plasma is generated in a large region surrounding the sputtering target (20). The plasma electrically connects the target (20) to a part of the coating machine that is not subject to deposition of sputtered material from the target (20). The plasma is generated by an applicator (26 or 27) which is independent of the target (20).