发明名称 Verfahren zum Zusammenbau von gedruckten Leiterplatten mit hoher Abwechselung
摘要 Components are assembled on printed circuit boards in groups to be manufactured together, and to minimise the overall set up time, the components are arranged in the groups in dependence on maximising board volume added per component. In a method of assembling components on a board using machines having a plurality of banks, a first cell of components is chosen which are installed on a high volume board for continuous installation from at least one of the banks. A setup of components is done in a different cell without having to interrupt the continuous installation of the components of the first cell. The installation of components is activated from the second cell after the setup is completed in order to install components on a lesser volume board. <IMAGE>
申请公布号 DE69120887(D1) 申请公布日期 1996.08.22
申请号 DE1991620887 申请日期 1991.09.27
申请人 HEWLETT-PACKARD CO., PALO ALTO, CALIF., US 发明人 DAVIS, THOMAS C., MOUNTAIN VIEW, CA 94040, US;SELEP, EVA M., FOLSOM, CA 95630, US
分类号 H05K13/04;H05K13/08;(IPC1-7):H05K13/08 主分类号 H05K13/04
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