Verfahren zum Beabstanden zweier Bauteile

摘要

In a method of spacing two components (esp. a chip (3) and a carrier (1) prior to soldering), which are brought to a predetermined spacing by a manipulator, the improvement is that (i) a sonic emitter (7) and a sonic receiver are mounted respectively on the carrier (1) and the chip manipulator or vice-versa; (ii) an acoustic coupling liq. is provided between the chip (3) and a solder layer (2) on the carrier (1); and (iii) manipulator movement of the chip (3) relative to the carrier (1) is slowed or stopped in accordance with the emitter signal detected by the receiver. Pref. the acoustic coupling liq. (4) is a flux or a low volatility alcohol which, on heating, evaporates without leaving a residue. The sonic emitter (7) produces ultrasound in the range above 100 kHz. USE/ADVANTAGE - used esp. for spacing an LED chip from a copper plate prior to soldering in the mfr. of a character generator for an LED printer. Extremely small spacings (e.g. 100 microns) can be accurately detected and maintained between the components.