发明名称 Thermoplastic compsn. with improved heat resistance and adhesion
摘要 Thermoplastic resin compsn. comprises 100 pts.wt. of: (a) 99-40 wt.% copolymer (I) of C2H4 and an alpha , beta -unsatd. carboxylate ester; (b) 1-60 wt.% polyphenylene ether (PPO); and (c) 1-50 pts. wt. partly hydrogenated copolymer (II) of an alkenyl-aromatic cpd. (III) and an aliphatic conjugated diene cpd. (IV). Pref. (I) is derived from an alkyl ester, esp. an alkyl (meth)acrylate, more esp. methyl (meth)acrylate. Pref. it contains 3-60 wt.% ester unit and has a melt index of 0.2-400 g/10 min (at 190 deg C to ASTM I-1238). Pref. PPO is in the form of particles of a disperse phase with a no. average particle size of 5 microns or less. It is pref. a homopolymer of 2,6-dimethylpehnol or 2,6-diphenylphenol or a copolymer of 2,6-xylenol with 3-methyl-6-tert.-butyl-phenol or 2,3,6-trimethylphenol; and has an intrinsic viscosity of 0.45 or less. (III) is pref. styrene, alpha -methylstyrene, vinyltoluene, vinylxylene, vinylnaphthalene and/or DVB. (IV) is pref. butadiene, isoprene, penta-1,3-diene and/or 2,3-dimethylbutadiene.
申请公布号 DE19605484(A1) 申请公布日期 1996.08.22
申请号 DE19961005484 申请日期 1996.02.14
申请人 SUMITOMO CHEMICAL CO., LTD., OSAKA, JP 发明人 SANADA, TAKASHI, ICHIHARA, JP;SUZUKI, YASURO, KISARAZU, JP
分类号 C08L23/02;C08L23/00;C08L23/08;C08L23/10;C08L23/16;C08L25/00;C08L25/10;C08L33/00;C08L33/04;C08L33/06;C08L33/08;C08L33/12;C08L35/06;C08L53/00;C08L53/02;C08L71/00;C08L71/12;C09J153/02;(IPC1-7):C08L33/06;C08L25/04;C08L23/04;C08L23/18;C08L23/26 主分类号 C08L23/02
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