PROCESS FOR BONDING A FLEXIBLE SUBSTRATE TO A CHIP

摘要

The invention concerns a process for thermally bonding contact elements (14, 15) of a flexible film substrate (10) to metallized contact areas (17) of an electronic component (12). The flexible substrate comprises a carrier layer (13) of transparent plastics. The rear of the contact elements is acted on by energy in the form of laser radiation (11). The transparency of the carrier layer (13), the absorption of the contact elements (14, 15) and the wavelength of the laser radiation (11) are adapted to one another such that the laser radiation is substantially guided through the carrier layer (13) and absorbed in the contact elements (14, 15). Pressure acts on the substrate (10) such that the contact elements (14, 15) of the substrate (10) and the metallized contact areas (17) of the component (12) abut one another in the region of the optical fibre orientation point during the action of the laser radiation (11).