| 摘要 |
<p>A surface mount device desoldering and removal tool (10) including a flexible carrier plate (12) and a plurality of heated legs (14) attached to the flexible carrier plate (12) for contacting the leads (52) of an electrical component (50). The flexible carrier plate (12) is sufficiently flexible so that the flexing of the carrier plate (12) allows the plurality of legs (14) to deflect outward to accommodate electrical components (50) of varying sizes. The plurality of legs (14) are heated by electrical resistance heating elements (22) to melt the solder (56) which connects an electrical component (50) to a circuit board (54). The legs (14) provide a grip on the leads (52) of the electrical component (50) which allows the removal tool (10) to lift the electrical component (50) when all the solder connections have been melted. The flexible carrier plate (12) is advantageously provided with shoulders (66) which allow the electrical component (50) to be easily removed from the removal tool (10).</p> |
