Master slice semiconductor device and method of forming it

摘要

A bonding pad (2) to be bonded to a lead electrode is formed to have an opening (7) with a substantially square plane shape, and a bonding pad (3) which is not to be bonded to a lead electrode is formed to have an opening (7) with a substantially square plane shape with a notched position (5a) in the center. The outer shapes of the electrode pads (2, 3) are varied in accordance with packages which contain semiconductor chip.