| 摘要 |
<p>A photocoupler device includes a light-emitting chip (11), a light-receiving chip (12), a light-emitting side lead frame (13) for individually holding the light emitting chip (11) and a light-receiving side lead frame (14) for individually holding the light-receiving chip (12). The light-emitting and light-receiving chips (11,12) are opposed to each other so as to be optically coupled and are completely covered with a light-transmissive resin (15) as a first molding layer, except in outside connecting terminal portions of the two lead frames (13, 14). The first molding layers is further covered with an opaque resin (16) as a second molding layer. In such a photocoupler device, the light-transmissive resin (15) is made to contain fillers in an amount of 80% by weight or more and directly cover the light-emitting chip, without needing silicone-resin coating for protecting the light-emitting chip (11). <IMAGE></p> |
