| 摘要 |
In a multi-chip module, a laminate wiring board is formed with stepped recesses. Electrodes to be connected to the electrodes of a bare-chip semiconductor device are subjected to non-electrolytic gold plating. This realizes wire bonding which is as short in distance and as low in loop as possible. To seal each recess with insulating resin, use is made of screen printing using a mesh screen which has a great aperture ratio and a small thickness. |
