发明名称 |
Infrared sensor having a bridge structure |
摘要 |
<p>An infrared sensor has a bridge portion which bridges a cave portion formed in a sensor substrate. The bridge portion comprises an infrared receiving portion and supporting portions for supporting the infrared receiving portion. The plane shape of the infrared receiving portion is a square or a circle which has a greater side length or a greater diameter than the width of the supporting portions to increase the amount of infrared received by the infrared receiving portion. <IMAGE></p> |
申请公布号 |
EP0534424(B1) |
申请公布日期 |
1996.08.21 |
申请号 |
EP19920116351 |
申请日期 |
1992.09.24 |
申请人 |
TERUMO KABUSHIKI KAISHA |
发明人 |
KUDO, TAKESHI;MORI, TAKEHISA;KOMATSU, KIYOSHI |
分类号 |
G01J1/02;G01J5/02;G01J5/12;G01J5/14;G01J5/20;H01L31/08;H01L31/09;H01L31/20;(IPC1-7):H01L31/09 |
主分类号 |
G01J1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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