EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR ELEMENT

摘要

The resin composition is prepared by adding epoxy-modified polyamic acid to the conventional epoxy resin composition comprising crezol novolak-type epoxy resin, hardener, inorganic filler, and curing accelerator. By the addition, the resin composition exhibits highly enhanced heat resistance and thus can result in a remarkable decrease of the number of cracks generated during the vapor pressure soldering process.