发明名称 Semiconductor light emitting element
摘要 <p>A semiconductor light emitting element comprising an n-type semiconductor substrate and a light emitting part comprising an n-type cladding layer composed of an InGaAlP compound semiconductor material, an active layer and a p-type cladding layer formed in that order from the substrate side by double heterojunction, wherein said semiconductor light emitting element satisfies at least one of the following conditions: A. the thickness of said active layer being greater than 0.75 mu m and not more than 1.5 mu m, and B. the thickness of said p-type cladding layer being 0.5 mu m - 2.0 mu m. According to the light emitting element of the present invention, an overflow of electron into the p-type cladding layer can be suppressed by setting the thickness of the active layer and the p-type cladding layer to fall within the above-mentioned specific ranges, as a result of which the element shows luminous efficiency peaked within the specified range. &lt;IMAGE&gt;</p>
申请公布号 EP0727827(A2) 申请公布日期 1996.08.21
申请号 EP19960102071 申请日期 1996.02.13
申请人 MITSUBISHI CABLE INDUSTRIES, LTD. 发明人 HIROAKI, OKAGAWA, C/O ITAMI FACTORY;TAKAYUKI, HASHIMOTO;KEIJI, MIYASHITA, C/O ITAMI FACTORY;TOMOO, YAMADA, C/O ITAMI FACTORY;KAZUYUKI, TADATOMO, C/O ITAMI FACTORY
分类号 H01L33/14;H01L33/30;H01L33/40;(IPC1-7):H01L33/00 主分类号 H01L33/14
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