发明名称 |
DRAM cell with a cradle-type capacitor |
摘要 |
An efficient method for manufacturing a cradle-shape capacitor for use as part of a DRAM cell in a silicon integrated circuit is described. The effective area of the capacitor plates is increased by providing a trench along the center of the capacitor which has the form of a polysilicon rectangular prism. The trench is formed by locating a heavily doped layer of silicon oxide on the surface and then heating the structure to a degree sufficient to cause significant outdiffusion of dopant from the silicon oxide into the polysilicon. A selective etching procedure is then used to remove only the area into which dopant has diffused, thereby creating the aforementioned trench.
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申请公布号 |
US5547890(A) |
申请公布日期 |
1996.08.20 |
申请号 |
US19950435197 |
申请日期 |
1995.05.05 |
申请人 |
VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION |
发明人 |
TSENG, HORNG-HUEI |
分类号 |
H01L21/02;H01L21/60;H01L21/768;H01L21/8242;(IPC1-7):H01L21/70;H01L27/00 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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