发明名称 DRAM cell with a cradle-type capacitor
摘要 An efficient method for manufacturing a cradle-shape capacitor for use as part of a DRAM cell in a silicon integrated circuit is described. The effective area of the capacitor plates is increased by providing a trench along the center of the capacitor which has the form of a polysilicon rectangular prism. The trench is formed by locating a heavily doped layer of silicon oxide on the surface and then heating the structure to a degree sufficient to cause significant outdiffusion of dopant from the silicon oxide into the polysilicon. A selective etching procedure is then used to remove only the area into which dopant has diffused, thereby creating the aforementioned trench.
申请公布号 US5547890(A) 申请公布日期 1996.08.20
申请号 US19950435197 申请日期 1995.05.05
申请人 VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION 发明人 TSENG, HORNG-HUEI
分类号 H01L21/02;H01L21/60;H01L21/768;H01L21/8242;(IPC1-7):H01L21/70;H01L27/00 主分类号 H01L21/02
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