| 摘要 |
PROBLEM TO BE SOLVED: To provide a low profile BGA package whose reliability is high, whose size is small, whose weight is light, whose thickness is small and cost performance is excellent. SOLUTION: A ball grid array(BGA) semiconductor package 30 contains a substrate 31 stuck on a support substrate 32. The substrate 31 has an opening 33 stretching from the upper surface to the lower surface. An integrated circuit chip 18 is stuck on the support substrate 32 by the opening 33. A bond pad 22 on the integrated circuit chip 18 is electrically connected with a ball pad 42 on the lower surface of the substrate 31. A conductive solder ball 26 is bonded to a ball pad 42. When the BGA semiconductor package 30 is mounted on an application board, the support substrate 32 provides a low profile, and functions as a stand-off for preventing the crush of the conductive ball 26. |
