| 摘要 |
PURPOSE: To make a semiconductor device uniform in resin material distribution so as to protect it against warpage and resin cracking caused by thermal shrinkage by a method wherein a semiconductor element is sealed up with resin keeping the one side of a semiconductor element and the side of a chip support opposite to its side bonded to the semiconductor element exposed. CONSTITUTION: A semiconductor element 1 is sealed up with molding resin 6 keeping the side 1b of a semiconductor element 1 opposite to its other side 1a and the side 3b of a chip support 3 opposite to its side 3a bonded to the semiconductor element 1 exposed. Therefore, the thickness of a package can be limited to the sum of the total thickness of the semiconductor element 1, an adhesive tape 2, and the chip support 3, so that a semiconductor device of this constitution can be lessened in thickness. As the molding resin 6 is averaged in distribution, the semiconductor device is hardly warped due to a thermal shrinkage, and the semiconductor element 1 housed in a package is relaxed in stress. Therefore, a semiconductor device free from resin cracking and high in reliability can be obtained. |
