| 摘要 |
PURPOSE: To remarkably reduce the time required for performing a bump leveling process so as to shorten the work time of the production of a semiconductor element by leveling the bumps of the element while the element is attracted to and carried by means of a nozzle after the bumps are formed on the electrodes of the element by using gold wires. CONSTITUTION: A capillary 12 driven in the X-, Y-, and Z-directions by means of a capillary driving section 12a forms bumps 3 in a semiconductor element 2 on a bump forming stage 9 by using gold wires. After the bumps are formed, a nozzle 1 attracts the element 2 by suction from the stage 9 and carries the element 2 to a tray 8a. While the element 2 is carried, the bumps 3 are leveled. Namely, the nozzle 1 approaches the element 2 by maintaining the plane 1c of its attracting surface 1b in parallel with the element 2 and makes the height of the bumps 3 uniform by deforming the front end sections of the bumps 3 by bringing the plane 1c into contact with the front ends of the bumps 3. |
